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in the grinding of brittle materials. The results of this inves-tigation lend strong evidence in support of the ductile-regime grinding hypothesis. Also, a model is proposed, defining the brittle-to-ductile transition in terms of the material properties of the workpiece and the rate of material removal.
Ductile Regime Grinding Brittle Materials. Ductileregime grinding of brittle materials researchgate the compression applied on the workpiece at the shear plane if it is of the hydrostatic type the brittle material can be ground in ductile mode this also increases the depth of cut considerably.
Ductile-regime grinding is a new technology made possible by the use of real-time control and precision engineering in the grinding process. By ensuring that the abrasive grinding forces do not exceed a threshold value, it is possible to grind materials that are normally considered "brittle" in such a way that the material removal takes place through plastic deformation rather than fracture ...
Ductile-Regime Turning of Brittle Materials by Single Point Diamond Ichiro Ogura, Yuichi Okazaki ... Blake and Scattergood investigated the critical depth of cut for single crystals of germanium ... T. Bifano, T. Dow, and R. Scattergood: Ductile Regime Grinding: A New Technology for Machining Brittle Materials. ASME, J. Eng. Ind., 113, 5 (1991 ...
Ductile-Regime Grinding of Brittle Materials. Published. January 1, 1997. ... Under appropriate conditions, brittle materials may be ground to produce surfaces with no observable fracture damage. This chapter reviews the techniques for producing such surfaces and the mechanisms of material removal involved. ... ductile grinding, glass ...
This article addresses the problem of monitoring the material removal regime (ductile versus brittle) that occurs during the grinding of brittle materials. Often a ductile grinding regime is desired, but currently there is no way to measure the grinding ductility .
Aug 07, 2013· The normal stress distribution profile associated with grinding a ductile material does not apply to grinding a brittle material like an advanced ceramic. Any induced tensile stress, which is usually caused by restricted thermal expansion at high temperatures, has already resulted in micro-cracking beneath the surface, as in a brittle material ...
PREDICTIVE MODELING FOR DUCTILE MACHINING OF BRITTLE MATERIALS A Dissertation Presented to The Academic Faculty By Sivaramakrishnan Venkatachalam In Partial Fulfillment of the Requirements for the Degree of Doctor of Philosophy in the George W. Woodruff School of Mechanical Engineering Georgia Institute of Technology December, 2007
In this study, ductile to brittle transition in ultra-micro-grinding (UMG) of hard brittle material is investigated. The characteristics of UMG process are studied, and differences between UMG and micro-grinding (MG) are investigated. The grain penetration depth considering rotary deviation is calculated, grain invalid cutting phenomenon is discussed, and the critical condition for grain ...
In ductile-regime grinding of brittle materials, Bifano26 has shown that if the maximum undeformed chip thickness h cu of single abrasive grit is less than the critical depth of penetration d c, the grind-ing will be in the ductile regime. The maximum unde-
The ability of VAM to machine brittle materials in the ductile regime at increased depth of cut is also described. ... Surface quality of workpiece during ceramic grinding is an ever-increasing ...
The transition zone occurs at the point where brittle strength equals ductile strength. In glacial ice this zone is at approximately 30 m (100 ft) depth. Not all materials, however, abide by this transition. It is possible and not rare for material above the transition zone to deform ductilely, and for material below to deform in a brittle manner.
Feb 14, 2018· Brittle materials have been widely employed for industrial applications due to their excellent mechanical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming.
Dec 16, 2014· Ductile regime grinding is an effective machining process that has been used for brittle materials for several years now. In ductile regime grinding, material is removed through plastic deformation, which reduces the risk of fractures and compromised materials. Regime grinding also eliminates or minimizes the need for polishing and lapping ...
only when chip removal is done at the atomic level. Recent developments of ductile mode machining of hard and brittle materials show that plastically deformed chip removal minimizes the subsurface damage of the workpiece. When chip deforma-tion takes place in the ductile regime, a .
undeformed) in ductile regime machining of brittle materials is usually at the submicron level, the behavior of single grits on the grinding wheel should resemble that of negatively raked cutting tools, and thereby could also be described by this model.
For the ductile mode grinding of hard and brittle materials, the critical machining depth ranges from 50 nm to 1 m [20]. To perform ductile mode machining of brittle materials, machine tools with high-accuracy servomechanisms (resolution 1.25–10 nm), high loop stiffness, and full flood
Similarities and differences between ductile material and brittle material are provided in this article. At a particular temperature, a ductile material exhibits substantial plastic deformation under external loading, while a brittle material breaks with negligible plastic deformation under tensile stress.
Keywords: grinding, material-removal, powder-regime, depth of cut, silicon ceramics Brittle fracture, analogous to indentation of a brittle material by a hard indenter, involves two principal crack systems: lateral . by a cylindrical grinding machine equipped with concrete grinding Vickers hardness, Mpa. 17.9.
Ductile-regime grinding is a new technology made possible by the use of real-time control and precision engineering in the grinding process. By ensuring that the abrasive grinding forces do not exceed a threshold value, it is possible to grind materials that are normally considered "brittle" in such a way that the material removal takes place through plastic deformation rather than fracture.
This process is known as ductile-regime grinding. When brittle materials are ground through a process of plastic deformation, surface finishes similar to those achieved in polishing or lapping are produced. Unlike polishing or lapping, however, grinding is a deterministic process, permitting finely controlled contour accuracy and complex shapes.
The ability to predict the critical depth for ductile-mode grinding of brittle materials is important to grinding process optimization and quality control. The traditional models for predicting the critical depth are mainly concerned with the material properties without considering the operation parameters.
Recent developments of ductile mode machining of hard and brittle materials show that plastically deformed chip removal minimizes the subsurface damage of the workpiece. When chip deforma-tion takes place in the ductile regime, a defect-free nano-surface is possible and it completely eliminates the polishing process.
2 Grinding of brittle materials Many advanced materials such as ceramics, silicon and optical glass are hard and brittle materials. Since 1980s, ductile regime grinding of brittle materials has been and is continuing to be an intensive research area because of its .
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